Samsung is among the companies developing and producing HBM2 and announced today it is starting mass production of its second generation HBM2, called Aquabolt. The new High Bandwidth Memory is the industry's first to deliver 2.4 gigabits-per-second (Gbps) data transfer speed per pin, and is aimed at the supercomputing and the graphics card market.
According to Samsung, the 8GB HBM2 package peaks at 307.2 GB/s of bandwidth, which is 9.6 times faster than on an 8Gb GDDR5 chip.
When it comes to performance, Samsung Electronics' second generation HBM2 memory controller features a "pin speed" of 2.4Gbps at 1.2V. As Samsung highlights, using four of the new HBM2 packages in a system will enable 1.2 terabytes-per-second (TBps) of bandwidth. Samsung said it has achieved 2.4Gbps for the first time in the industry by using its core technologies such as "signal transmission optimized designing" and "heating control".
A single 8GB HBM2 package, for example, consists of eight 8Gb HBM2 dies that are vertically interconnected using over 5,000 TSVs per die.
In order to hit 2.4Gbps data rate at rather impressive 1.2V, Samsung had to minimize the collateral clock skew by applying some new TSV technologies.
Samsung didn't say when it would be supplying the new memory to partners although if it's already in mass production, one can hope that partner availability won't be too far out. Other improvements include and increased number of thermal bumps which should provide better cooling and an additional protective layer at the bottom which will give the package better overall physical strength to protect it from damage.
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